Documenting the trail as we blaze it

Follow CDimension’s journey as we engineer to scale the next computing frontier. Our blog shares how we’re rethinking chip design from the ground up to help power tomorrow’s AI, robotics, and cloud.

Vision

Building the Next-Generation AI Chip: A 3D Integrated Approach

The evolution of AI chips has been rapid. In recent years, we moved from using general CPUs, to GPUs, to AI-specific accelerators (TPUs, NPUs, etc.), each providing boosts in performance and efficiency. However, almost all of these are still fundamentally 2D chips placed on boards with supporting memory and power components. The next-generation AI chip flips this paradigm by consolidating everything into a 3D integrated stack.

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