In recent years, 2D materials have garnered intense academic interest for their extraordinary electrical, optical, mechanical, and quantum properties. From graphene to transition metal dichalcogenides (TMDs) like MoS₂ and WSe₂, and insulating materials like h-BN, the range of possible applications spans transistors, photonics, display technologies, quantum computing, and beyond.
Yet despite this promise, a common perception persists: 2D materials are laboratory novelties, not production-ready solutions. This skepticism stems largely from early methods of fabrication—most notably the Nobel Prize-winning Scotch tape exfoliation method—which allowed researchers to isolate atomically thin materials but only in microscopic flakes, suitable for scientific exploration, not scalable manufacturing.
This perception, however, is now outdated–and that’s where CDimension comes in.
The Official Launch of CDimension: Scalable 2D Material Synthesis
Over the past few years, the field of 2D materials research has seen major strides in scalable synthesis, especially through chemical vapor deposition (CVD). Apart from Graphene, single-layer films of MoS₂, and other semiconducting or insulating 2D crystals can now be grown on various substrates, opening up pathways toward integration into modern semiconductor workflows.
With that, I’m proud to announce that today marks a key milestone for CDimension: the official launch of our company and the commercial availability of our ultra-thin 2D semiconductor materials. We are launching with a mission not just to synthesize 2D materials, but to industrialize them.
Now, with our ultra-thin 2D semiconductor materials commercially available for sampling and integration, we’re taking the first visible step toward our long-term vision of vertically integrated chips that unify compute, memory, and power into a single high-efficiency system. We believe the future of high-performance electronics, particularly in a post-Moore's Law world, depends on radically new materials, and CDimension is building the pipeline to deliver those materials at scale.
Six Core Innovations That Enable Industry Adoption
CDimension has solved a series of critical challenges that historically prevented 2D materials from reaching commercial use. These innovations span materials engineering, device integration, and system-level compatibility.
- Wafer-Scale Uniform Growth (8” & 12”)
We have demonstrated uniform, single-layer growth of 2D materials across full wafers, addressing batch-to-batch variation, seeding reproducibility, and film uniformity—all prerequisites for industrial adoption. - High Material Quality
Our films exhibit record-high electron mobilities, surpassing 100 cm²/V·s on single-layer semiconductors. This quality is essential for high-performance transistor applications and demonstrates the maturity of our synthesis processes. - Ohmic Contact Engineering
One of the biggest historical bottlenecks in 2D electronics is contact resistance. CDimension has developed a method for forming reliable ohmic contacts with 2D semiconductors, bridging a longstanding materials-device integration gap. - Reliability Benchmarking
We’ve verified that our devices can meet the reliability metrics of silicon-based transistors. From time-dependent dielectric breakdown to threshold voltage stability, our materials pass critical stress tests. - Low-Temperature Synthesis for Monolithic 3D Integration
Our materials are not just scientifically interesting—they’re practically usable. With process flows compatible with standard semiconductor fabs, our 2D films can be implemented without significant equipment overhaul. - Process Compatibility with CMOS Flow
These six breakthroughs transform 2D materials from “lab-grade samples” into industrial, CMOS-compatible platforms—ready for real-world application in logic, memory, photonics, and more.
Why 2D Materials Matter: Efficiency, Scaling, and the Future of AI
The push toward 2D materials is not about novelty—it’s about necessity. As AI workloads skyrocket and power budgets hit their limits, conventional silicon-based architectures struggle to scale. Here’s where 2D materials shine:
- Ultimate Thinness = Perfect Gate Control
At atomically thin dimensions, 2D channels offer unbeatable electrostatic control, minimizing leakage and improving subthreshold behavior. This makes them ideal for ultra-scaled logic and low-power switching. - Minimal Parasitic
Bulk semiconductors, like silicon, suffer from body effects and junction capacitance. 2D materials eliminate these parasitic by nature, reducing energy loss and enabling faster switching. - Heterogeneous 3D Integration
With low-temp synthesis and high material uniformity, 2D layers can be stacked atop silicon dies, forming dense interconnects with minimal capacitance. This reduces latency and power consumption in 3D chiplets, compared to conventional chip-to-chip bonding. - Energy Efficiency at Scale
For data centers and edge AI, reducing every milliwatt matters. 2D materials support both high performance and low leakage, enabling transistor-level and architecture-level energy efficiency.
In short, 2D materials offer not just an alternative—but a leap forward—in transistor design, chip scaling, and energy-efficient computing.
What Makes CDimension Unique
CDimension is not a typical materials startup. We are vertically integrated, from material synthesis to IC design. This dual capability gives us an uncommon advantage:
- We synthesize materials with the end application in mind. That means thinking about integration, process compatibility, reliability, and stack engineering—not just atomic structure.
- Our engineers co-optimize material and circuit design. We understand how electrical performance translates into system performance, allowing us to tailor synthesis recipes for actual device constraints.
- We don’t just deliver films—we deliver stacks. From oxide-semiconductor-metal assemblies to complete back-end-of-line (BEOL) ready structures, we help customers build working systems, not just run experiments.
- This system-level approach—System Technology Co-Optimization (STCO)—is central to our philosophy. We believe future computing platforms must be co-designed across materials, devices, circuits, and applications. CDimension embodies this belief, not as a slogan, but as a development methodology.
Where We’re Going
Our long-term vision is bold: we want to enable a new generation of AI, quantum, robotics, and high-performance systems, powered by 2D-enabled chip platforms. But we know we must start with step one: materials.
By delivering wafer-scale, high-quality, process-compatible 2D materials, we aim to drive adoption in research labs, R&D centers, and corporate pilot lines.
As more players realize that 2D materials are ready, CDimension will be seen not just as a supplier—but as a platform, a collaborator, and a pioneer in the shift beyond silicon.